- The thermal pad can use gaps for heat transfer, fill gaps, connect irregular surfaces or fill holes. The heat-conducting silicone cushion can be placed between the heating element and the radiator to effectively transfer the heat of the heating component to the radiator to achieve the effect of heat conduction and insulation.
- Thermal pad is made of silicone material, which has the properties of stable thermal conductivity, insulation, softness and elasticity. Thermal pad can meet the thermal conductivity requirements of most electronic products and improve overall heat dissipation efficiency. Thermal pad is slightly sticky and easy to use. If you need to strengthen thermal pad stickiness, you can increase the adhesive according to your needs.
- The size of the thermal pad is 100 x 100 x 1 mm, The thermal conductivity of the thermal pad is 2 W/mK, suitable for -50~200°C, the
- Heat conductive silicone cushion can be cut into the suitable size as needed. Clean your device first, then tear off the protective film on one side of the thermal pad, stick thermal conductivity pad on top of the heat sink, lightly press it to stabilize thermal pad, then tear off the protective film o
- Silicone thermal pad can meet the insulation and thermal conductivity requirements of most hardware. Thermal Pad can be used for computer CPU graphics cards, automotive machines, notebook computers, DVDs, VCDs, LIDs, set-top boxes, CD-ROMs, processors, IGPT modules and all required heat dissipation devices.
