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🧰 Solderless MB-102 MB102 Breadboard 830 Tie-Point PCB BreadBoard (High Quality) for Arduino

🧰 Solderless MB-102 MB102 Breadboard 830 Tie-Point PCB BreadBoard (High Quality) for Arduino

Regular price Rs.700.00 PKR
Regular price Sale price Rs.700.00 PKR
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🧰 Solderless MB-102 MB102 Breadboard 830 Tie-Point PCB BreadBoard (High Quality) for Arduino

🔹 Product Overview

The MB-102 solderless breadboard is a full-size 830 tie-point prototyping board designed for building and testing electronic circuits without soldering. It’s perfect for Arduino, Raspberry Pi, ESP modules, and DIY electronics projects.

With its reusable design and organized layout, it’s ideal for students, hobbyists, and engineers.


⭐ Key Features

830 Tie Points – Large workspace for complex circuits
Solderless Design – No soldering required, easy to modify circuits
Dual Power Rails – Simplified power distribution (VCC & GND)
Standard 2.54mm Pitch – Compatible with ICs, resistors & jumper wires
Reusable & Durable – Long life spring clips (thousands of insertions)
Self-Adhesive Back – Easy mounting on surfaces
Interlockable Design – Combine multiple boards for bigger projects


⚙️ Specifications

  • Model: MB-102
  • Total Tie Points: 830
    • 630 Terminal Points
    • 200 Power Rail Points
  • Dimensions: ~16.5 × 5.5 × 1 cm
  • Wire Compatibility: 20–29 AWG
  • Pitch: 2.54mm (standard)
  • Material: ABS plastic + nickel-plated spring clips
  • Rated Voltage/Current: up to ~300V / 3–5A

🔧 Applications

  • Arduino & microcontroller projects
  • Circuit prototyping & testing
  • Electronics labs & student learning
  • DIY robotics & IoT projects
  • Sensor and module testing

💡 Benefits

  • Build circuits quickly without soldering
  • Easy to replace or adjust components
  • Reusable for multiple projects
  • Clean and organized wiring with power rails
  • Saves time in development & testing

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Buy MB-102 solderless breadboard 830 tie points for Arduino & DIY electronics. High quality, reusable, ideal for prototyping circuits. Best price in Pakistan.

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